Electronic device for temperature compensation and method for operation thereof

ABSTRACT

An electronic device according to various embodiments may include: a temperature sensor; a sensor unit; and at least one processor. The at least one processor may be configured to determine that a temperature value detected by the temperature sensor exceeds a temperature threshold value; determine whether a condition is satisfied, the condition being related to at least one of a flexible state of the electronic device, whether a cover case is mounted on the electronic device, or a distance between a user&#39;s contact position on the electronic device and a position of the at least one processor; based on the condition being satisfied, operate according to a first clock level corresponding to the temperature value; and based on the condition not being satisfied, operate according to a second clock level higher than the first clock level.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a bypass continuation application of anInternational Patent Application No. PCT/KR2022/005209, filed on Apr.11, 2022, which is based on and claims priority to Korean PatentApplication No. 10-2021-0119972, filed on Sep. 8, 2021 in the KoreanIntellectual Property Office, the disclosures of which are incorporatedby reference herein in their entireties.

BACKGROUND 1. Field

Various embodiments of the disclosure relate to an electronic device forperforming temperature compensation and a method for operating the same.

2. Description of Related Art

Various services and additional functions provided through electronicdevices, for example, portable electronic devices such as smartphones,are gradually increasing. In order to improve usability of suchelectronic devices and to satisfy various user demands, communicationservice providers or electronic device manufacturers are competitivelydeveloping electronic devices to provide various functions and todifferentiate themselves from others. As a result, the level of variousfunctions provided through electronic devices are becoming higher.

An electronic device, when operating at a high clock speed, may providethe user with a high performance, but this may pose a problem such asbattery consumption or heating. The electronic device may adjusthardware performance such as the clock speed according to a temperaturecompensation algorithm for heating control. For example, the temperaturecompensation algorithm may detect the temperature related to an element(for example, a processor or a battery) of the electronic device and, ifthe temperature reaches a given temperature threshold value, may shutdown the processor or decrease the clock speed, thereby minimizing theheating.

A temperature compensation algorithm of an electronic device, which isbased on decreasing a clock speed, may degrade the performance of theelectronic device. However, the temperature compensation algorithm isapplied despite performance degradation in order to avoid userinconvenience caused by heating. On the other hand, if variousconditions for performing the temperature compensation are consideredbased on the characteristics of the electronic device, the user may usethe electronic device with a better performance (for example, clockspeed) while not being affected by heating.

For example, in one scheme of the temperature compensation algorithm, ifthe processor temperature reaches 80°, the electronic device maydecrease the clock speed for the processor and, if the temperature isabove 85°, may shut down the processor. However, in various situationsuch as, for example, if the electronic device is a flexible device andis in an open state (or an unfolded state), if a cover case is mountedthereon, and/or according to the manner in which the user grips theelectronic device, the user may not sensitively react to the processortemperature. If the same temperature compensation algorithm isnevertheless applied without considering characteristics and/or state ofthe electronic device, a problem may occur in that the clock speed ofthe processor is unnecessarily limited regardless of degree of heatingsensed by the user.

For example, if the electronic device is a flexible device, and if thesame temperature compensation condition is used to compensate for thetemperature without considering the flexible state (e.g., a folded stateof an unfolded state) of the electronic device, the clock may beunnecessarily limited. Based on whether a cover case is mounted on theelectronic device, and/or according to the manner in which the usergrips the electronic device, a processor temperature at which the userfeels inconvenienced may be different, but if temperature compensationis performed without considering such conditions, the performance of theelectronic device may be degraded by unnecessary clock limitation.

An electronic device and a method for operating the same according tovarious embodiments may apply a temperature compensation algorithm ofthe electronic device by considering at least one of a flexible state ofthe electronic device, a state regarding whether a cover is mounted ornot, or the manner in which the user grips the same.

An electronic device and a method for operating the same according tovarious embodiments may loosen clock speed limitation for heatingcontrol of the electronic device, based on at least one of a flexiblestate of the electronic device, a state regarding whether a cover ismounted or not, or the manner in which the user grips the same.

SUMMARY

An electronic device according to various embodiments may include: atemperature sensor; a sensor unit; and at least one processoroperatively connected to the temperature sensor and the sensor unit,wherein the at least one processor is configured to identify that atemperature value detected by the temperature sensor exceeds atemperature threshold value; determine whether a condition is satisfied,the condition being related to at least one of a flexible state of theelectronic device, whether a cover case is mounted on the electronicdevice, or a distance between a user's contact position with respect tothe electronic device and a position at which the at least one processoris positioned in the electronic device; based on the condition beingsatisfied, operate according to a first clock level corresponding to thetemperature value for heating control; and based on the condition notbeing satisfied, operate according to a second clock level higher thanthe first clock level.

An operation method of an electronic device according to variousembodiments may include identifying that a temperature value detected bya temperature sensor included in the electronic device exceeds atemperature threshold value; determining whether a condition issatisfied, the condition being related to at least one of a flexiblestate of the electronic device, whether a cover case is mounted on theelectronic device, or a distance between a user's contact position withrespect to the electronic device and a position at which at least oneprocessor is positioned in the electronic device; based on the conditionbeing satisfied, driving the at least one processor according to a firstclock level corresponding to the temperature value for heating control;and based on the condition not being satisfied, driving the at least oneprocessor according to a second clock level higher than the first clocklevel.

An electronic device and a method for operating the same according tovarious embodiments may operate the electronic device at a higher clockspeed while performing heat control than related art temperaturecompensation conditions, according to the operating state of theelectronic device, and may maximize usability.

An electronic device and a method for operating the same according tovarious embodiments may apply a temperature compensation algorithm thatutilizes conditions such as a screen size of a flexible device, whethera cover case is mounted or not, or a difference in the gripping mannerof a user, thereby minimizing performance degradation of a processor dueto temperature compensation, and providing the user with a betterprocessing environment.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of variousembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a block diagram of an electronic device in a networkenvironment according to various embodiments;

FIG. 2 is a block diagram of an electronic device according to variousembodiments;

FIGS. 3A, 3B, and 3C illustrate a configuration of an electronic deviceimplemented as a foldable device according to various embodiments;

FIGS. 4A and 4B illustrate a change in a form factor according to amanner of gripping an electronic device according to variousembodiments;

FIG. 5 is a graphic representation of detection values of a grip sensoraccording to gripping in various embodiments;

FIGS. 6A and 6B are diagrams illustrating heat propagation according toa gripping manner in various embodiments;

FIGS. 7A, 7B, 7C, and 7D are diagrams illustrating a distance from aprocessor according to a gripping manner in various embodiments;

FIG. 8 is a diagram illustrating an operation of detecting mounting of acover case according to various embodiments;

FIG. 9 is a flowchart illustrating an operation for temperaturecompensation according to various embodiments;

FIG. 10 is a flowchart illustrating an operation of determining acondition of an electronic device for temperature compensation accordingto various embodiments; and

FIG. 11 is a flowchart illustrating another example of an operation ofdetermining a condition of an electronic device for temperaturecompensation according to various embodiments.

DETAILED DESCRIPTION

FIG. 1 is a block diagram illustrating an electronic device 101 in anetwork environment 100 according to various embodiments. Referring toFIG. 1 , the electronic device 101 in the network environment 100 maycommunicate with an electronic device 102 via a first network 198 (e.g.,a short-range wireless communication network), or an electronic device104 or a server 108 via a second network 199 (e.g., a long-rangewireless communication network). According to an embodiment, theelectronic device 101 may communicate with the electronic device 104 viathe server 108. According to an embodiment, the electronic device 101may include a processor 120, memory 130, an input module 150, a soundoutput module 155, a display module 160, an audio module 170, a sensormodule 176, an interface 177, a connecting terminal 178, a haptic module179, a camera module 180, a power management module 188, a battery 189,a communication module 190, a subscriber identification module (SIM)196, or an antenna module 197. In some embodiments, at least one of thecomponents (e.g., the connecting terminal 178) may be omitted from theelectronic device 101, or one or more other components may be added inthe electronic device 101. In some embodiments, some of the components(e.g., the sensor module 176, the camera module 180, or the antennamodule 197) may be implemented as a single component (e.g., the displaymodule 160).

The processor 120 may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 101 coupled with theprocessor 120, and may perform various data processing or computation.According to one embodiment, as at least part of the data processing orcomputation, the processor 120 may store a command or data received fromanother component (e.g., the sensor module 176 or the communicationmodule 190) in volatile memory 132, process the command or the datastored in the volatile memory 132, and store resulting data innon-volatile memory 134. According to an embodiment, the processor 120may include a main processor 121 (e.g., a central processing unit (CPU)or an application processor (AP)), or an auxiliary processor 123 (e.g.,a graphics processing unit (GPU), a neural processing unit (NPU), animage signal processor (ISP), a sensor hub processor, or a communicationprocessor (CP)) that is operable independently from, or in conjunctionwith, the main processor 121. For example, when the electronic device101 includes the main processor 121 and the auxiliary processor 123, theauxiliary processor 123 may be adapted to consume less power than themain processor 121, or to be specific to a specified function. Theauxiliary processor 123 may be implemented as separate from, or as partof the main processor 121.

The auxiliary processor 123 may control, for example, at least some offunctions or states related to at least one component (e.g., the displaymodule 160, the sensor module 176, or the communication module 190)among the components of the electronic device 101, instead of the mainprocessor 121 while the main processor 121 is in an inactive (e.g.,sleep) state, or together with the main processor 121 while the mainprocessor 121 is in an active (e.g., executing an application) state.According to an embodiment, the auxiliary processor 123 (e.g., an imagesignal processor or a communication processor) may be implemented aspart of another component (e.g., the camera module 180 or thecommunication module 190) functionally related to the auxiliaryprocessor 123. According to an embodiment, the auxiliary processor 123(e.g., the neural processing unit) may include a hardware structurespecified for artificial intelligence model processing. An artificialintelligence model may be generated by machine learning. Such learningmay be performed, e.g., by the electronic device 101 where theartificial intelligence is performed or via a separate server (e.g., theserver 108). Learning algorithms may include, but are not limited to,e.g., supervised learning, unsupervised learning, semi-supervisedlearning, or reinforcement learning. The artificial intelligence modelmay include a plurality of artificial neural network layers. Theartificial neural network may be a deep neural network (DNN), aconvolutional neural network (CNN), a recurrent neural network (RNN), arestricted boltzmann machine (RBM), a deep belief network (DBN), abidirectional recurrent deep neural network (BRDNN), deep Q-network or acombination of two or more thereof but is not limited thereto. Theartificial intelligence model may, additionally or alternatively,include a software structure other than the hardware structure.

The memory 130 may store various data used by at least one component(e.g., the processor 120 or the sensor module 176) of the electronicdevice 101. The various data may include, for example, software (e.g.,the program 140) and input data or output data for a command relatedthereto. The memory 130 may include the volatile memory 132 or thenon-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system (OS) 142, middleware 144, oran application 146.

The input module 150 may receive a command or data to be used by anothercomponent (e.g., the processor 120) of the electronic device 101, fromthe outside (e.g., a user) of the electronic device 101. The inputmodule 150 may include, for example, a microphone, a mouse, a keyboard,a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The sound output module 155 may output sound signals to the outside ofthe electronic device 101. The sound output module 155 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record. The receiver maybe used for receiving incoming calls. According to an embodiment, thereceiver may be implemented as separate from, or as part of the speaker.

The display module 160 may visually provide information to the outside(e.g., a user) of the electronic device 101. The display module 160 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment, the displaymodule 160 may include a touch sensor adapted to detect a touch, or apressure sensor adapted to measure the intensity of force incurred bythe touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 170 may obtainthe sound via the input module 150, or output the sound via the soundoutput module 155 or an external electronic device (e.g., an electronicdevice 102 (e.g., a speaker or a headphone)) directly or wirelesslycoupled with the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 176 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice (e.g., the electronic device 102) directly or wirelessly.According to an embodiment, the interface 177 may include, for example,a high definition multimedia interface (HDMI), a universal serial bus(USB) interface, a secure digital (SD) card interface, or an audiointerface.

A connecting terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device (e.g., the electronic device 102). According to anembodiment, the connecting terminal 178 may include, for example, anHDMI connector, a USB connector, an SD card connector, or an audioconnector (e.g., a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment, the haptic module 179 mayinclude, for example, a motor, a piezoelectric element, or an electricstimulator.

The camera module 180 may capture a still image or moving images.According to an embodiment, the camera module 180 may include one ormore lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to theelectronic device 101. According to one embodiment, the power managementmodule 188 may be implemented as at least part of, for example, a powermanagement integrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment, the battery 189 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 101 and the external electronic device (e.g., theelectronic device 102, the electronic device 104, or the server 108) andperforming communication via the established communication channel. Thecommunication module 190 may include one or more communicationprocessors that are operable independently from the processor 120 (e.g.,the application processor (AP)) and supports a direct (e.g., wired)communication or a wireless communication. According to an embodiment,the communication module 190 may include a wireless communication module192 (e.g., a cellular communication module, a short-range wirelesscommunication module, or a global navigation satellite system (GNSS)communication module) or a wired communication module 194 (e.g., a localarea network (LAN) communication module or a power line communication(PLC) module). A corresponding one of these communication modules maycommunicate with the external electronic device 104 via the firstnetwork 198 (e.g., a short-range communication network, such asBluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared dataassociation (IrDA)) or the second network 199 (e.g., a long-rangecommunication network, such as a legacy cellular network, a 5G network,a next-generation communication network, the Internet, or a computernetwork (e.g., LAN or wide area network (WAN)). These various types ofcommunication modules may be implemented as a single component (e.g., asingle chip), or may be implemented as multi components (e.g., multichips) separate from each other. The wireless communication module 192may identify or authenticate the electronic device 101 in acommunication network, such as the first network 198 or the secondnetwork 199, using subscriber information (e.g., international mobilesubscriber identity (IMSI)) stored in the subscriber identificationmodule 196.

The wireless communication module 192 may support a 5G network, after a4G network, and next-generation communication technology, e.g., newradio (NR) access technology. The NR access technology may supportenhanced mobile broadband (eMBB), massive machine type communications(mMTC), or ultra-reliable and low-latency communications (URLLC). Thewireless communication module 192 may support a high-frequency band(e.g., the mmWave band) to achieve, e.g., a high data transmission rate.The wireless communication module 192 may support various technologiesfor securing performance on a high-frequency band, such as, e.g.,beamforming, massive multiple-input and multiple-output (massive MIMO),full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, orlarge scale antenna. The wireless communication module 192 may supportvarious requirements specified in the electronic device 101, an externalelectronic device (e.g., the electronic device 104), or a network system(e.g., the second network 199). According to an embodiment, the wirelesscommunication module 192 may support a peak data rate (e.g., 20 Gbps ormore) for implementing eMBB, loss coverage (e.g., 164 dB or less) forimplementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each ofdownlink (DL) and uplink (UL), or a round trip of 1 ms or less) forimplementing URLLC.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 101. According to an embodiment, the antenna module197 may include an antenna including a radiating element composed of aconductive material or a conductive pattern formed in or on a substrate(e.g., a printed circuit board (PCB)). According to an embodiment, theantenna module 197 may include a plurality of antennas (e.g., arrayantennas). In such a case, at least one antenna appropriate for acommunication scheme used in the communication network, such as thefirst network 198 or the second network 199, may be selected, forexample, by the communication module 190 from the plurality of antennas.The signal or the power may then be transmitted or received between thecommunication module 190 and the external electronic device via theselected at least one antenna. According to an embodiment, anothercomponent (e.g., a radio frequency integrated circuit (RFIC)) other thanthe radiating element may be additionally formed as part of the antennamodule 197.

According to various embodiments, the antenna module 197 may form ammWave antenna module. According to an embodiment, the mmWave antennamodule may include a printed circuit board, an RFIC disposed on a firstsurface (e.g., the bottom surface) of the printed circuit board, oradjacent to the first surface and capable of supporting a designatedhigh-frequency band (e.g., the mmWave band), and a plurality of antennas(e.g., array antennas) disposed on a second surface (e.g., the top or aside surface) of the printed circuit board, or adjacent to the secondsurface and capable of transmitting or receiving signals of thedesignated high-frequency band.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 101 and the external electronicdevice 104 via the server 108 coupled with the second network 199. Eachof the electronic devices 102 or 104 may be a device of a same type as,or a different type, from the electronic device 101. According to anembodiment, all or some of operations to be executed at the electronicdevice 101 may be executed at one or more of the external electronicdevices 102, 104, or 108. For example, if the electronic device 101should perform a function or a service automatically, or in response toa request from a user or another device, the electronic device 101,instead of, or in addition to, executing the function or the service,may request the one or more external electronic devices to perform atleast part of the function or the service. The one or more externalelectronic devices receiving the request may perform the at least partof the function or the service requested, or an additional function oran additional service related to the request, and transfer an outcome ofthe performing to the electronic device 101. The electronic device 101may provide the outcome, with or without further processing of theoutcome, as at least part of a reply to the request. To that end, acloud computing, distributed computing, mobile edge computing (MEC), orclient-server computing technology may be used, for example. Theelectronic device 101 may provide ultra low-latency services using,e.g., distributed computing or mobile edge computing. In anotherembodiment, the external electronic device 104 may include aninternet-of-things (IoT) device. The server 108 may be an intelligentserver using machine learning and/or a neural network. According to anembodiment, the external electronic device 104 or the server 108 may beincluded in the second network 199. The electronic device 101 may beapplied to intelligent services (e.g., smart home, smart city, smartcar, or healthcare) based on 5G communication technology or IoT-relatedtechnology.

FIG. 2 is a block diagram of an electronic device 101 according tovarious embodiments.

Referring to FIG. 2 , the electronic device 101 may include at least oneof a processor 210, a temperature sensor 220, a clock driving unit 260,or a memory 270. The electronic device 101 may further include a sensorunit including at least one of a first sensor 230, a second sensor 240,or a third sensor 250. According to an embodiment, the electronic device101 may further include at least one component among the componentsillustrated in FIG. 1 . According to various embodiments, the electronicdevice 101 may be a portable electronic device which includes aprocessing unit and a temperature sensor and may be carried by a user,such as a smart phone or a tablet computer, and an example thereof isnot limited. The electronic device 101 may include at least a part ofthe configuration and/or function of the electronic device 101 of FIG. 1.

According to an embodiment, the processor 210 may include at least oneprocessing unit among processors (e.g., the main processor 121 or thecoprocessor 123) in the processor 120 of FIG. 1 , for example, at leastone of a central processing unit (CPU), an application processor (AP),or a graphic processing unit (GPU). The processor 210 may be operativelyand/or electrically connected to at least one of the temperature sensor220, the memory 270, and the clock driving unit 260. The processor 210may also be operatively and/or electrically connected to at least one ofthe first sensor 230, the second sensor 240, or the third sensor 250,and control the performance of the processor 210 configured to drive theelectronic device 101 according to an internal and/or external situationof the electronic device 101. In an embodiment, the processor 210 mayselect one of a plurality of clock levels according to a giventemperature compensation algorithm, and operate (for example, execute atleast one application) by using the selected one clock level. Theprocessor 210 may change a clock level according to an internal and/orexternal situation (for example, the current temperature) of theelectronic device 101 during operation. The plurality of clock levelsmay be discrete values, continuous values, or values within a givenrange.

The temperature compensation algorithm relates to a policy fordetermining a clock speed during operation of the processor 210 and, forexample, may include an operation of increasing or decreasing a clocklevel for the processor 210 according to an internal and/or externaltemperature of the electronic device 101. According to an embodiment,the processor 210 may select a clock level according to a processortemperature (for example, an AP temperature or a CPU temperature) in theelectronic device 101.

For example, in a case where the processor temperature is within a firsttemperature range (e.g., a lower limit of the range being greater than60° C.), the processor 210 may operate by using one clock level (forexample, a clock level lower than the clock level currently used by theprocessor 210) corresponding to the first temperature range among theplurality of clock levels according to the given temperaturecompensation algorithm. For example, in a case where the processortemperature is within a second temperature range (e.g., a lower limit ofthe range being greater than 70° C.), the processor 210 may operate byusing one clock level (for example, a clock level lower than the clocklevel currently used by the processor 210 or a clock level lower thanthe clock level corresponding to the first temperature range)corresponding to the second temperature range among the plurality ofclock levels according to the given temperature compensation algorithm.For example, in a case where the external temperature is within a thirdtemperature range (e.g., a lower limit of the range being greater than80° C.), the processor 210 may operate by using one clock level (forexample, a clock level lower than the clock level currently used by theprocessor 210 or a clock level lower than the clock level correspondingto the second temperature range) corresponding to the third temperaturerange according to the given temperature compensation algorithm.

According to various embodiments, the clock driving unit 260 mayprovide, to the processor 210, a clock signal having a clock leveldetermined according to the control of the processor 210. Information onthe plurality of clock levels which may be provided by the clock drivingunit 260 may be stored in the memory 270. The clock driving unit 260 mayprovide, to the processor 210, a clock signal according to a clock levelprovided from the processor 210 among the plurality of clock levels.

An example of the plurality of clock levels which are stored in thememory 270 and may be selected by the processor 210 according to variousembodiments is shown in <Table 1> below.

TABLE 1 Level CPU GPU L0 2.8 GHz 800 MHz L1 2.5 GHz 700 MHz L2 2.3 GHz600 MHz L3 2.0 GHz 500 MHz L4 1.8 GHz 400 MHz L5 1.5 GHz 300 MHz L6 1.2GHz 200 MHz L7 1 GHz 100 MHz L8 800 MHz L9 600 MHz L10 500 MHz

Referring to <Table 1>, the processor 210 (for example, the AP) mayidentify, from the memory 270, a plurality of clock levels respectivelycorresponding to at least one (for example, the CPU and/or GPU) of theprocessors included in the electronic device 101. In the example of<Table 1>, a clock speed for each clock level may be specified withrespect to the CPU or GPU. The higher the clock level (that is, closerto L0), the higher the clock speed may be. In an embodiment, in asituation where temperature compensation is not required, the processor210 may control each processor, for example, the CPU and GPU, to operateaccording to the highest clock speed according to the maximum clocklevel (e.g., L0), for example, 2.8 GHz and 800 MHz, respectively.

In an embodiment, in a situation where temperature compensation isrequired (for example, a high temperature exceeding a temperaturethreshold value among a plurality of temperature threshold values), theprocessor 210 may control each processor, for example, the CPU tooperate at a clock speed according to a clock level lower than themaximum clock level, for example, one of 2.5 GHz to 500 MHz. In anembodiment, in a situation where temperature compensation is required(for example, a high temperature exceeding a temperature threshold valueamong a plurality of temperature threshold values), the processor 210may control, for example, the GPU to operate at a clock speed accordingto a clock level lower than the maximum clock level, for example, one of700 MHz to 100 MHz.

According to an embodiment, the temperature sensor 220 may be atemperature sensor in the sensor module 175 of FIG. 1 . According tovarious embodiments, the temperature sensor 220 may include a sensormodule configured to measure the temperature of the electronic device101. In an embodiment, the temperature sensor 220 may include athermistor, and the thermistor may be positioned on a main printedcircuit board (PCB) on which the processor 210 and the memory 270 aredisposed. In an embodiment, the processor 210 may measure an internaltemperature and/or an external temperature of the electronic device 101by using the temperature sensor 220. In an embodiment, the temperaturesensor 220 may include a sensor module configured to measure each of atleast one of the components of the electronic device 101.

In an embodiment, the temperature sensor 220 may include at least one ofa temperature sensor module for an AP, a temperature sensor module for abattery (for example, the battery 189), a temperature sensor module fora sub-battery (for example, which may be included in the battery 189), atemperature sensor module for a USB circuit (for example, which may beincluded in the interface 177), a temperature sensor module for acharging circuit (for example, which may be included in the battery189), a temperature sensor module for a direct current (DC) powercircuit (for example, which may be included in the battery 189), or atemperature sensor module for a Wi-Fi communication module (for example,which may be included in the wireless communication module 192). In anembodiment, the temperature sensor 220 may include a temperature sensormodule configured to identify an external temperature of the electronicdevice 101 or an ambient temperature of the electronic device 101.

In various embodiments, the electronic device 101 may include at leastone of the first sensor 230, the second sensor 240, or the third sensor250. At least one of the first sensor 230, the second sensor 240, or thethird sensor 250 may be included in the sensor module 176 of FIG. 1 .

In an embodiment, in a case where the electronic device 101 is aflexible device (for example, a foldable device, a rollable device, or adevice including a flexible display), the first sensor 230 may detect aflexible state (or folding state) of the electronic device 101 andprovide information on the flexible state to the processor 210. In anembodiment, in a case where the electronic device 101 is a foldabledevice, the flexible state (or folding state) may include one of aclosed state (or a folded state) or an open state (or an unfoldedstate). The closed state may include a state in which both panels of theelectronic device 101 are fully folded and/or a state in which the bothpanels are almost fully folded (for example, an angle between the bothpanels of the electronic device 101 is less than a first thresholdvalue). The open state may include a state in which both panels of theelectronic device 101 are fully unfolded and/or a state in which theboth panels are almost fully unfolded (for example, an angle between theboth panels of the electronic device 101 exceeds a second thresholdvalue).

In an embodiment, in a case where the electronic device 101 is arollable device, the closed state may mean a state in which the degreeto which a display screen of the electronic device 101 is opened (forexample, an open length or area) is less than a first threshold value,and the open state may mean a state in which the degree to which thedisplay screen of the electronic device 101 is opened (for example, anopen length or area) exceeds a second threshold value. In an embodiment,the flexible state (or the folding state) of the electronic device 101may further include an intermediate state. The intermediate state mayinclude a state between the closed state and the open state of theelectronic device 101.

In an embodiment, the second sensor 240 may detect a state indicatingwhether a cover case is mounted on the electronic device 101. In a casewhere the cover case is mounted on the electronic device 101, the secondsensor 240 may provide, to the processor 210, information indicatingthat the cover case is in a mounted state.

In an embodiment, the third sensor 250 may detect information on amanner of gripping the electronic device 101 and provide the informationto the processor 210. In an embodiment, the third sensor 250 may includea grip sensor and an acceleration sensor. The grip sensor may detectinformation on whether an external object such as a user's hand or aball is in contact with an external housing of the electronic device101, and may provide the information to the processor 210. Theacceleration sensor may detect a rotation angle (for example, anabsolute angle ranging from 0 to 360) of the electronic device 101 andprovide the rotation angle to the processor 210. The processor 210 maydetermine a manner of gripping the electronic device 101, based on theinformation provided from the third sensor 250. In an embodiment, thegripping manner may include whether an operation mode of the electronicdevice 101 is a landscape mode or a portrait mode. In an embodiment, thegripping manner may indicate how close a user's contact part (forexample, a hand or cheek) is to the processor 210 of the electronicdevice 101, and a distance between a user's contact part and a specificcomponent (for example, the AP) of the electronic device 101.

In various embodiments, when it is determined that a temperature valueprovided from the temperature sensor 220 exceeds a temperature thresholdvalue and thus a temperature compensation algorithm needs to beperformed, the processor 210 may determine to use a limited clock level(that is, a lower clock level) corresponding to the temperature value oruse a higher clock level, based on information received from at leastone of the first sensor 230, the second sensor 240, or the third sensor250. The detailed descriptions of various embodiments related to theoperation of the processor 210 will be described later.

According to various embodiments, the memory 270 may include a volatilememory and a non-volatile memory, but a specific implementation exampleis not limited thereto. The memory 270 may include at least a part ofthe configuration and/or function of the memory 130 of FIG. 1 . Inaddition, the memory 270 may store at least a part of the program 140 ofFIG. 1 .

The memory 270 may be operatively, functionally, and/or electricallyconnected to the processor 210, and may store various instructions whichmay be executed by the processor 210. Such instructions may includecontrol commands such as arithmetic and logical operations, datamovement, and input/output which may be recognized by the processor 210.

According to various embodiments, the processor 210 may not be limitedto an arithmetic operation and data processing function which may beimplemented in the electronic device 101. However, various embodimentsfor detecting a processor temperature of the electronic device 101 anddetermining a clock speed based on the processor temperature will bedescribed herein. The operations of the processor 210 to be describedlater may be performed by loading the instructions stored in the memory270.

An electronic device 101 according to various embodiments may include:the temperature sensor 220, the sensor unit 230, 240, or 250, and the atleast one processor 210 operatively connected to the temperature sensor220 and the sensor unit 230, 240, or 250, wherein the at least oneprocessor 210 is configured to identify that a temperature valuedetected by the temperature sensor 220 exceeds a first temperaturethreshold value; determine whether a condition is satisfied, thecondition being related to at least one of a flexible state of theelectronic device 101, whether a cover case is mounted on the electronicdevice 101, or a distance between a user's contact position with respectto the electronic device 101 and a position at which the at least oneprocessor 210 is positioned in the electronic device 101, operateaccording to a first clock level corresponding to the temperature valuefor heating control based on the condition being satisfied, and operateaccording to a second clock level higher than the first clock levelbased on the condition not being satisfied.

In an embodiment, the condition may include at least one of a conditionthat the electronic device is a flexible device and the electronicdevice is in a closed state, a condition that the cover case is notmounted on the electronic device, or a condition that the distance iswithin a distance threshold value.

In an embodiment, the condition may include a condition that theelectronic device is a flexible device and is in a closed state, thecover case is not mounted on the electronic device, and the distance iswithin a distance threshold value.

In an embodiment, the first clock level may be one of a plurality ofclock levels configured for a central processing unit (CPU) and/or agraphic processing unit (GPU) included in the electronic device.

In an embodiment, the second clock level may be one of a plurality ofclock levels configured for a central processing unit (CPU) and/or agraphic processing unit (GPU) included in the electronic device.

In an embodiment, the second clock level may be greater than the firstclock level by a given value.

In an embodiment, the detected temperature value may include at leastone temperature value measured for an application processor (AP) and/ora battery included in the electronic device.

In an embodiment, the temperature threshold value for executing thetemperature compensation may be adjusted according to a distance betweenthe user's contact position and the at least one processor. For example,the at least one processor is further configured to determine a secondtemperature threshold value based on the distance between the user'scontact position and the position at which the at least one processor ispositioned in the electronic device, and based on the condition beingsatisfied and further based on the temperature value detected by thetemperature sensor exceeding the second temperature threshold value,operate according to the first clock level corresponding to thetemperature value.

In an embodiment, the sensor unit may include at least one of: a firstsensor configured to detect whether a flexible state of the electronicdevice is a closed state or an open state, a second sensor configured todetect whether the cover case is in a mounted state or an unmountedstate with respect to the electronic device (e.g., whether the covercase is mounted on the electronic device or not), or a third sensorconfigured to detect a distance between the user's contact position andthe position at which the at least one processor is positioned in theelectronic device.

In an embodiment, the electronic device is a foldable device, and theflexible state may be one of a folded state and an unfolded state. In anembodiment, the electronic device is a rollable device, and the flexiblestate may be one of a state in which an open area of a display screen ofthe electronic device is less than a first threshold value and a statein which the open area of the display screen exceeds a second thresholdvalue.

FIGS. 3A, 3B, and 3C illustrate a configuration of the electronic device101 implemented as a foldable device according to various embodiments.

Referring to FIG. 3A, the electronic device 101 may include a firstpanel 302 and a second panel 304 which are foldable. The first panel 302and the second panel 304 may be connected by a foldable connector 306,and a flexible display may be disposed on the first panel 302, thesecond panel 304, and the connector 306. In an embodiment, the secondpanel 304 may include the processor 210 (for example, an AP).

Referring to FIG. 3B, in a state in which the electronic device 101 isclosed (for example, an angle between the first panel 302 and the secondpanel 304 is less than a first threshold value), heat 310 may bedetected on the second panel 304 including the processor 210.

Referring to FIG. 3C, in a state in which the electronic device 101 isopen (for example, an angle between the first panel 302 and the secondpanel 304 exceeds a second threshold value), heat 315 detected on thesecond panel 304 including the processor 210 may have a temperaturelower than the heat 310 generated in a state in which the electronicdevice 101 is closed.

As shown in the examples of FIGS. 3B and 3C, a surface temperature maybe dispersed as a display screen of the electronic device 101implemented as a flexible device is unfolded or open. Since the surfacetemperature of the electronic device 101 is lowered when the surfacetemperature is dispersed, processing performance and usability may beimproved by relaxing a temperature compensation condition (for example,including a temperature threshold value) for executing a temperaturecompensation algorithm in the processor 210 in a state in which theelectronic device 101 is unfolded or open.

The following <Table 2> shows an example of a temperature differencebetween when the electronic device 101 is in a closed state and when theelectronic device 101 is in an open state in a case where the electronicdevice 101 is a foldable device.

TABLE 2 Number Items of times Closed Open Difference AP_temp 1 34.9 33.81.1 2 36.3 35.3 1.0 BAT_temp 1 29.1 28.8 0.3 2 29.8 29.7 0.1 SUBBAT_temp1 29.0 29.0 0 2 29.3 29.5 −0.2 USB_temp 1 29.2 28.8 0.4 2 29.7 29.6 0.1CHG_temp 1 33.9 32.9 1.0 2 35.0 34.2 0.8 DC_temp 1 32.9 31.9 1.0 2 34.133.3 0.8 WIFI_temp 1 29.8 29.6 0.2 2 30.0 29.9 0.1

<Table 2> shows a temperature (i.e., a Celsius temperature) measured foreach component when the electronic device 101 executes a camera preview,at each of two times. AP temp may represent a temperature measured foran AP (for example, the processor 120 or which is included in theprocessor 210), BAT temp may represent a temperature measured for a mainbattery (for example, the battery 189), SUBBAT_temp may represent atemperature measured for a sub-battery (for example, which may beincluded in the battery 189), USB temp may represent a temperaturemeasured for a USB circuit (for example, which may be included in theinterface 177), CHG_temp may represent a temperature measured for acharging circuit (for example, which may be included in the battery189), DC temp may represent a measured temperature for a direct current(DC) power circuit (for example, which may be included in the battery189), and WIFI temp may represent a temperature measured for a Wi-Ficommunication module (for example, which may be included in the wirelesscommunication module 192).

As shown in <Table 2>, in a state in which the display screen of theelectronic device 101 is unfolded, such as an unfolded state or an openstate, it can be seen that a temperature is measured to be low even inthe same operation as the surface temperature of the electronic device101 is dispersed. In particular, it can be seen from <Table 2> that atemperature difference with respect to the AP among the components ofthe electronic device 101 is 1.1 degrees, which is the largest.

In various embodiments, in a case where a state of the display screen ofthe electronic device 101 is changed from a closed state to an openstate, as a temperature is dispersed on the surface of the electronicdevice 101, it may take longer for an internal temperature of theelectronic device 101 to reach a temperature threshold value fortemperature compensation. Accordingly, the processor 210 may relievelimitation of the maximum clock level of the electronic device 101 in astate in which the display screen of the electronic device 101 isgreatly opened (for example, an unfolded state or an open state). In anembodiment, in a case where the electronic device 101 is in the openstate, the processor 210 may determine to use a higher maximum clocklevel than in a closed state under the same temperature condition. Invarious embodiments, relaxation of a temperature compensation conditionto use a higher maximum clock level can benefit from improved processingperformance and increased usability.

FIGS. 4A and 4B illustrate a change in a form factor according to amanner of gripping the electronic device 101 according to variousembodiments. FIG. 4A illustrates four operation modes of the electronicdevice 101 according to a user's gripping manner, such as a portraitmode 405, a landscape mode 410, a portrait reverse mode 415, and alandscape reverse mode 420. FIG. 4B illustrates a change in a formfactor of the electronic device 101 to a sensor angle measured by anacceleration sensor (for example, the sensor module 176 or the thirdsensor 250) of the electronic device 101.

In various embodiments, the processor 210 of the electronic device 101may receive information on whether any of upper, lower, left, and rightportions which are edges of the electronic device 101 are in contactwith a user's hand from a grip sensor (for example, the sensor module176 or the third sensor 250), and receive a rotation angle (for example,an absolute angle) from an acceleration sensor (for example, the sensormodule 176 or the third sensor 250) to detect a change in the formfactor of the electronic device 101.

In an embodiment, the portrait mode 405 may mean that a rotation angledetected by the acceleration sensor of the electronic device 101 is in arange 405 a of 0 to 45 degrees or 315 to 360 degrees. In an embodiment,the landscape mode 410 may mean that a rotation angle detected by theacceleration sensor of the electronic device 101 is in a range 410 a of45 to 135 degrees. In an embodiment, the portrait reverse mode 415 maymean that a rotation angle detected by the acceleration sensor of theelectronic device 101 is in a range 415 a of 135 to 180 degrees. In anembodiment, the landscape reverse mode 420 may mean that a rotationangle detected by the acceleration sensor of the electronic device 101is in a range 420 a of 225 to 315 degrees.

As described above, a rotation angle of the acceleration sensor for eachoperation mode of the electronic device 101 is different, and theprocessor 210 may distinguish a shape of a user's grip when gripping theelectronic device 101 (that is, a gripping manner), based on anoperation mode of the electronic device 101 determined based on therotation angle and information detected by the grip sensor.

FIG. 5 is a graphic representation of detection values of a grip sensoraccording to gripping in various embodiments.

Referring to FIG. 5 , two fingers 505 of a user hold lower ends 510 ofboth side surfaces of the electronic device 101, and values detected bya grip sensor of the electronic device 101 may indicate that the lowerends 510 of the both side surfaces are contact positions of the userwith respect to the electronic device 101. In an embodiment, theprocessor 210 may determine a user's gripping manner, based on one ofthe operation modes of FIG. 4A determined by the acceleration sensor andthe user's contact position detected by the grip sensor.

FIGS. 6A and 6B are diagrams illustrating heat propagation according toa gripping manner in various embodiments.

Referring to FIG. 6A, in an embodiment, the processor 210 (for example,an AP) may be positioned at the top of the electronic device 101. When ahand 605 of a user holds lower ends of both side surfaces of theelectronic device 101, heat may be propagated with reference to aposition of the processor 210 where a temperature is concentrated.Referring to FIG. 6B, heat having a higher temperature is shown at arear upper end 620 where the processor 210 is positioned, compared to afront upper end 610 of the electronic device 101. Therefore, in a casewhere the user's hand holds the lower ends of both side surfaces of theelectronic device 101, the user may not directly detect the heat shownat the rear upper end 620 of the processor 210. Accordingly, theprocessor 210 may determine not to immediately apply limitation of aclock level according to a temperature compensation algorithm, based onthe gripping manner, or determine to use a clock level higher than theclock level corresponding to the current temperature detected by atemperature sensor (for example, the temperature sensor 220).

In various embodiments, in a case where the electronic device 101 is aflexible device, a gripping manner may be more diverse, and a sensorytemperature felt by a user may also be changed according to a grippingmanner. In an embodiment, a physical distance between a component (forexample, the AP) which generates the most heat in the electronic device101 and a user's contact position with respect to the electronic device101 may be closely related to a gripping manner, and a sensorytemperature felt by the user may be changed according to the physicaldistance.

FIGS. 7A, 7B, 7C, and 7D are diagrams illustrating a distance from aprocessor according to a gripping manner in various embodiments.

Referring to FIG. 7A, in a case where the electronic device 101 operatesin a portrait mode and both hands 705 of a user hold both side surfacesof the electronic device 101, a distance 710 between a position wherethe processor 210 is disposed in the electronic device 101 and a contactposition 715 of the user is close, and heat generated by the processor210 may be easily and directly propagated to the hands of the user.

Referring to FIG. 7B, in a case where the electronic device 101 operatesin a landscape mode and both hands 705 of a user hold both side surfacesof the electronic device 101, a distance 720 between the processor 210and a contact position 715 of the user is close, and likewise, heatgenerated by the processor 210 may be easily and directly propagated tothe hands 705 of the user.

In an embodiment, in a case where the gripping manner as shown in FIG.7A or 7B is detected, since heat generated by the processor 210 may bequickly propagated directly to a user, the processor 210 may determineto use the clock level (e.g., maximum clock level) corresponding to thecurrent temperature according to a temperature compensation algorithm.

Referring to FIG. 7C, in a case where the electronic device 101 operatesin a landscape mode and a hand 725 of a user holds one side surface ofthe electronic device 101, a distance 730 between the processor 210 anda contact position 735 of the user may be relatively long, and heat ofthe processor 210 is propagated on the surface of the electronic device101, so that the user may feel a lower sensory temperature compared tothe heat generated by the processor 210.

Referring to FIG. 7D, the electronic device 101 is a foldable device andthe electronic device 101 is in an open state. In a case where theelectronic device 101 in the open state operates in a landscape mode andboth hands 735 of a user hold both side surfaces of the electronicdevice 101, a distance 740 between the processor 210 and a contactposition 745 of the user may be relatively long, and the user may not besensitive to heat of the processor 210.

In an embodiment, in a case where the gripping manner as shown in FIG.7C or 7D is detected, the processor 210 may determine to use a clocklevel higher than the maximum clock level allowed at the currenttemperature according to the temperature compensation algorithm.

In various embodiments, the electronic device 101 generates the mostheat in the periphery of the processor 210 (for example, an AP), and thedegree of heating may decrease as a distance from the processor 210increases. Since a position of the processor 210 (for example, the AP)is fixedly determined from the time of designing the electronic device101, the processor 210 may detect an operation mode (for example, one ofa landscape mode, a portrait mode, a landscape reverse mode, and aportrait reverse mode) of the electronic device 101 and a user'sgripping manner (for example, a distance between the processor 101 and auser's contact position) through a third sensor (for example, a gripsensor and an acceleration sensor), and differentially apply thetemperature compensation algorithm according to the user's grippingmanner and operation mode.

The following <Table 3> shows an example of a temperature compensationalgorithm according to a distance between a position where the processor210 (for example, the AP) is disposed and a user's contact position.

TABLE 3 Distance from AP Temperature threshold value  0~25% 70° C.26~50% 75° C. 51~75% 80° C. 76~100%  85° C.

In an embodiment, the processor 210 (for example, the AP) may determineto apply a temperature compensation algorithm by applying differenttemperature threshold values according to a distance between theprocessor 210 (for example, the AP) and a user's contact position. Themaximum distance between the processor 210 (for example, the AP) and theuser's contact position may be fixedly determined according to the shapeof the electronic device 101. In an embodiment, in a case where theelectronic device 101 is used without being held by a user (for example,in a case of being placed on a desk or a cradle), a distance between theprocessor 210 (for example, the AP) and the user's contact position maybe regarded as the maximum distance. In an embodiment, the processor 210may divide a ratio corresponding to the maximum distance into aplurality of sections, for example, four sections such as 0 to 25%, 26to 50%, 51 to 75%, and 76 to 100%, and differentially determine atemperature threshold value for the temperature compensation algorithmaccording to a distance between each processor 210 (for example, the AP)and a user's contact position.

In an embodiment, in a case where a distance between the AP and a user'scontact position is in a section of 26 to 50% of the maximum distance,the temperature threshold value for the temperature compensationalgorithm may be determined to be 75 degrees, and when the currenttemperature detected by the temperature sensor 220 exceeds 75 degrees,the processor 210 may determine to decrease the current clock level by agiven value (or a given ratio) or to use a clock level corresponding tothe current temperature. In an embodiment, in a case where a distancebetween the AP and a user's contact position is in a section of 76 to100% of the maximum distance, the temperature threshold value for thetemperature compensation algorithm may be determined to be 85 degrees,and when the current temperature detected by the temperature sensor 220exceeds 85 degrees, the processor 210 may determine to decrease thecurrent clock level by a given value (or a given ratio) or to use aclock level corresponding to the current temperature. In variousembodiments, since a temperature threshold value increases as a distancebetween the AP and a user's contact position increases, the user may usethe electronic device 101 with better processing performance.

FIG. 8 is a diagram illustrating an operation of detecting mounting of acover case according to various embodiments.

Referring to FIG. 8 , the electronic device 101 may mount a cover case805 for device protection or aesthetic reasons. In a case where thecover case 805 is mounted on the electronic device 101, the propagationof heat generated by an AP positioned at the back side of the electronicdevice 101 to a user's skin may be mitigated. The electronic device 101may include a sensor (for example, the second sensor 240) which maydetect whether the cover case 805 is mounted, and the processor 210 maydetermine whether the cover case 805 is mounted, based on informationreceived from the second sensor 240, and use the same in a temperaturecompensation algorithm.

In an embodiment, the processor 210 may relax a temperature compensationcondition (for example, a temperature threshold value) for executing atemperature compensation algorithm in a state in which the cover case805 is mounted. In an embodiment, the processor 210 may use a highertemperature threshold value for the temperature compensation algorithmin a state in which the cover case 805 is mounted (referred to as amounted state). According to an embodiment, a temperature thresholdvalue for the temperature compensation algorithm in a state in which thecover case 805 is not mounted (referred to as an unmounted state) is,for example, 60 degrees, and when the current temperature exceeds 60degrees, the processor 210 may determine to decrease the current clocklevel by a given value (or a given ratio) or to use a clock levelcorresponding to the current temperature. On the other hand, in themounted state, the processor 210 may change the temperature thresholdvalue for the temperature compensation algorithm to a higher value, forexample, 65 degrees, compared to the unmounted state, and maintain thecurrent clock level until the current temperature exceeds 65 degrees.

In various embodiments, at the time of using the electronic device 101,a 1 degree difference in a high temperature range may requiretemperature compensation for a longer period of time compared to a 1degree difference in a low temperature range. For example, in a lowtemperature section of 30 to 31 degrees, the time until a temperaturedrops from 31 degrees to 30 degrees is short, but in a high temperaturesection of 80 to 81 degrees, it may require more time for a temperatureto drop from 81 degrees to 80 degrees. Therefore, in a case where aclock level is limited according to the temperature compensationalgorithm in the high temperature section, a user may experienceprocessing performance degradation for a longer period of time. Invarious embodiments, by relaxing the clock level limitation (that is,increasing the maximum clock level) according to the characteristics(for example, a folding state, a state regarding whether a cover case ismounted, or a gripping manner) of the electronic device 101, a user mayuse the electronic device 101 without degradation in performance for alonger period of time.

In various embodiments, for example, in a case where a temperaturecompensation relaxation condition based on at least one of a flexiblestate (or a folding state) of the electronic device 101, a stateregarding whether a cover case is mounted, or a gripping manner is notsatisfied, the processor 210 may determine to use a clock levelcorresponding to the current temperature. In an embodiment, in a casewhere the temperature compensation relaxation condition is satisfied,the processor 210 may determine to use a clock level higher than theclock level corresponding to the current temperature. In an embodiment,the higher clock level may be a given value or may be determined byincreasing the clock level corresponding to the current temperature by agiven value (or a given ratio). In an embodiment, the higher clock levelmay be determined based on at least one of a flexible state (or afolding state) of the electronic device 101, a state regarding whether acover case is mounted, or a gripping manner.

FIG. 9 is a flowchart illustrating an operation for temperaturecompensation according to various embodiments.

Referring to FIG. 9 , in operation 905, the processor 210 may identify atemperature of the electronic device 101 from, for example, thetemperature sensor 220. In an embodiment, the temperature may be atemperature of at least one component (for example, an AP and/or abattery) among the components included in the electronic device 101. Inoperation 910, the processor 210 may determine whether the identifiedtemperature exceeds a temperature threshold value TH T given accordingto a temperature compensation algorithm. If the identified temperaturedoes not exceed the temperature threshold value, the processor 210 mayreturn to operation 905. If the identified temperature exceeds thetemperature threshold value, the processor 210 may proceed to operation915.

In operation 915, the processor 210 may determine whether a firstcondition (for example, a temperature compensation executing condition)according to the characteristics of the electronic device 101 issatisfied. In an embodiment, the first condition may be related to atleast one of a flexible state (or a folding state) of the electronicdevice 101, a state regarding whether a cover case is mounted, or agripping manner. In an embodiment, in a case where the electronic device101 is a flexible device, the first condition may include a state inwhich the electronic device 101 is closed. In an embodiment, the firstcondition may include a state in which a cover case (for example, thecover case 805) is not mounted on the electronic device 101. In anembodiment, the first condition may include a state in which a distancebetween a user's contact position according to a manner of gripping theelectronic device 101 and a position where an AP is disposed in theelectronic device 101 does not exceed a given distance threshold value.

If the first condition is satisfied, the processor 210 may proceed tooperation 920. In an embodiment, the processor 210 may proceed tooperation 920 when the first condition is continuously satisfied for aspecified time interval. If the first condition is not satisfied, theprocessor 210 may proceed to operation 925.

In operation 920, the processor 210 may determine to use a clock levelcorresponding to the identified temperature (hereinafter, referred to asa first clock level). In an embodiment, the first clock level may be avalue determined according to a temperature compensation algorithm forheating control. In an embodiment, the processor 210 may readinformation on the first clock level from the memory 270, provide theinformation to the clock driving unit 260, and receive a clock signalhaving a clock speed of the first clock level according to theinformation from the clock driving unit 260. In an embodiment, the clocksignal may be provided to a CPU and/or a GPU among a plurality ofprocessing units included in the processor 210.

In operation 925, the processor 210 may determine to use a clock levelhigher than the first clock level (hereinafter referred to as a secondclock level). In an embodiment, the processor 210 may read informationon the second clock level from the memory 270, provide the informationto the clock driving unit 260, and receive a clock signal having a clockspeed of the second clock level according to the information from theclock driving unit 260. In an embodiment, the clock signal may beprovided to the CPU and/or the GPU among the plurality of processingunits included in the processor 210. In an embodiment, the second clocklevel may be a value corresponding to the identified temperature andhigher than the first clock level. In an embodiment, the second clocklevel may be a value to which the temperature compensation algorithm forheating control is not applied.

Through the above operations, in a case where the first condition beingrelated to at least one of a flexible state (or a folding state) of theelectronic device 101, a state regarding whether a cover case ismounted, or a gripping manner is not satisfied, the processor 210 maydetermine to use a clock level higher than the clock level correspondingto the current temperature, thereby reducing degradation in processingperformance.

The following <Table 4> shows examples of conditions for relaxing atemperature compensation condition of the electronic device 101.

TABLE 4 State regarding Folding whether cover Gripping mannerClassification state case is mounted (distance from AP) S1 ClosedUnmounted Close S2 Non-close S3 Mounted Close S4 Non-close S5 OpenUnmounted Close S6 Non-close S7 Mounted Close S8 Non-close

Referring to <Table 4>, the processor 210 may determine a plurality ofconditions (for example, at least one of S1, S2, S3, S4, S5, S6, S7, orS8) according to whether a folding state of the electronic device 101 isa closed state or an open state, whether a state regarding whether acover case is mounted with respect to the electronic device 101 is anunmounted state or a mounted state, and whether a distance between an APand a user's contact position according to a gripping manner is close(for example, not exceeding a distance threshold value) or non-close(for example, exceeding a distance threshold value). In an embodiment,the first condition of operation 915 may include at least one ofconditions S1 to S8 of <Table 4>.

In an embodiment, the first condition may include a state in which afolding state of the electronic device 101 is a closed state and adistance between a user's contact position and the AP is within adistance threshold value. In an embodiment, the first condition mayinclude a state in which a folding state of the electronic device 101 isa closed state and the cover case is not mounted. In an embodiment, thefirst condition may include a state in which a distance between a user'scontact position and the AP is within a distance threshold value and thecover case is not mounted. In addition, various other combinations maybe possible.

In an embodiment, the first condition of operation 915 may include S1 of<Table 4>. S1 may include a state in which the electronic device 101 isin a closed state, the cover case is in an unmounted state, and adistance from the AP is close. In S1, heat of the electronic device 101may be directly propagated to a user's body, and accordingly, theprocessor 210 may apply the first clock level according to the currenttemperature. On the other hand, in a case where the condition of S1 isnot satisfied, the heat of the electronic device 101 may be propagatedon the surface of the electronic device 101 or may be blocked by thecover case, and accordingly, the processor 210 may apply the secondclock level higher than the first clock level according to the currenttemperature.

In an embodiment, the second clock level may be a clock level currentlybeing used by the processor 210. In an embodiment, the second clocklevel may be a level having one or two steps higher than the first clocklevel based on <Table 1>. In an embodiment, the second clock level maybe a clock level determined to correspond to the current condition ofthe electronic device 101, for example, one of S2 to S8.

FIG. 10 is a flowchart illustrating an operation of determining acondition of the electronic device 101 for temperature compensationaccording to various embodiments. Operations to be described below in anembodiment may correspond to operation 915 of FIG. 9 . In an embodiment,operation 915 may include at least one of the operations of FIG. 10 .

Referring to FIG. 10 , in operation 1005, in a case where the electronicdevice 101 is a flexible device, the processor 210 may determine whetherthe electronic device 101 is in a closed state, based on, for example,information provided from the first sensor 230. In a case where theelectronic device 101 is not in a closed state, in other words, in anopen state, the processor 210 may proceed to operation 1025 anddetermine that the first condition for executing the temperaturecompensation is not satisfied (that is, the temperature compensationcondition is relaxed and a higher clock level is used, as in operation925). In a case where the electronic device 101 is in a closed state,the processor 210 may proceed to operation 1010. In an embodiment, in acase where the electronic device 101 maintains a closed state for aspecified time interval, the processor 210 may proceed to operation1010.

In operation 1010, the processor 210 may determine whether a cover case(for example, the cover case 805) is mounted on the electronic device101, based on, for example, information provided from the second sensor240. In a case where the cover case 805 is mounted on the electronicdevice 101, in other words, in a mounted state, the processor 210 mayproceed to operation 1025 and determine that the first condition forexecuting the temperature compensation is not satisfied (that is, thetemperature compensation condition is relaxed and a higher clock levelis used, as in operation 925). In a case where the cover case 805 is notmounted on the electronic device 101, in other words, in an unmountedstate, the processor 210 may proceed to operation 1015. In anembodiment, in a case where the electronic device 101 maintains anunmounted state for a specified time interval, the processor 210 mayproceed to operation 1015.

In operation 1015, the processor 210 may determine whether a distancebetween a user's contact position with respect to the electronic device101 and the processor 210 (for example, an AP) exceeds a given distancethreshold value TH D, based on, for example, information provided fromthe third sensor 250. In an embodiment, the information may includevalues detected by an acceleration sensor indicating whether anoperation mode of the electronic device 101 is a landscape mode, aportrait mode, a landscape reverse mode, or a portrait reverse mode. Inan embodiment, the information may include values detected by a gripsensor indicating a user's contact position with respect to theelectronic device 101. In a case where the distance from the AP exceedsthe distance threshold value, the processor 210 may proceed to operation1025 and determine that the first condition for executing thetemperature compensation is not satisfied (that is, the temperaturecompensation condition is relaxed and a higher clock level is used, asin operation 925). If the distance from the AP does not exceed thedistance threshold value, the processor 210 may proceed to operation1020. In an embodiment, the processor 210 may proceed to operation 1020in a case where the distance from the AP maintains a state of exceedingthe distance threshold value for a specified time interval.

In operation 1020, the processor 210 may determine that the firstcondition is satisfied, and proceed to operation 920 of FIG. 9 .

FIG. 11 is a flowchart illustrating another example of an operation ofdetermining a condition of the electronic device 101 for temperaturecompensation according to various embodiments. Operations to bedescribed below in an embodiment may correspond to operation 915 of FIG.9 .

Referring to FIG. 11 , in operation 1105, for example, the processor 210may identify a temperature of the electronic device 101 from thetemperature sensor 220. In an embodiment, the temperature may be atemperature of at least one component (for example, an AP and/or abattery) among the components included in the electronic device 101. Inoperation 1110, the processor 210 may determine whether the identifiedtemperature exceeds a first temperature threshold value T1 (for example,60 degrees) given according to a temperature compensation algorithm. Ifthe identified temperature does not exceed the first temperaturethreshold value, the processor 210 may return to operation 1105. If theidentified temperature exceeds the first temperature threshold value,the processor 210 may proceed to operation 1115.

In operation 1115, the processor 210 may determine whether a firstcondition (for example, a temperature compensation executing condition)according to the characteristics of the electronic device 101 issatisfied. In an embodiment, the first condition may be based on atleast one of a flexible state (or a folding state) of the electronicdevice 101, a state regarding whether a cover case is mounted, or agripping manner. In an embodiment, the first condition may include S1shown in <Table 4>. In an embodiment, the first condition may include atleast one condition and S1 shown in <Table 4>. If the first condition issatisfied, the processor 210 may proceed to operation 1120. If the firstcondition is not satisfied, the processor 210 may proceed to operation1125.

In operation 1120, the processor 210 may determine to use a clock levelcorresponding to the first temperature threshold value (hereinafterreferred to as a first clock level), for example, an L2 level (including2.3 GHz for a CPU and 600 MHz for a GPU) as shown in <Table 1>. In anembodiment, the processor 210 may read information on the L2 level fromthe memory 270, provide the information to the clock driving unit 260,and receive a clock signal having a clock speed of the L2 level from theclock driving unit 260.

In operation 1125, the processor 210 may determine to use a clock levelhigher than the first clock level (hereinafter referred to as a secondclock level), for example, an L1 level (including 2.5 GHz for a CPU and700 MHz for a GPU) as shown in <Table 1>. In an embodiment, theprocessor 210 may read information on the L1 level from the memory 270,provide the information to the clock driving unit 260, and receive aclock signal having a clock speed of the L1 level according to theinformation from the clock driving unit 260. After operation 1120 or1125, the processor 210 may proceed to operation 1130. In an embodiment,the second clock level may be determined to be higher than the firstclock level by a given value A. In an embodiment, the second clock levelmay refer to a clock speed obtained by increasing the clock speed of thefirst clock level by a predetermined value.

In operation 1130, for example, the processor 210 may determine whetherthe temperature of the electronic device 101 detected by the temperaturesensor 220 exceeds a second temperature threshold value T2 (for example,70 degrees) given according to the temperature compensation algorithm.If the temperature does not exceed the second temperature thresholdvalue, the processor 210 may return to operation 1105. If the identifiedtemperature exceeds the second temperature threshold value, theprocessor 210 may proceed to operation 1135.

In operation 1135, the processor 210 may determine whether theabove-described first condition is satisfied. In an embodiment, thefirst condition may include S1 shown in <Table 4> or may include atleast one condition and S1 shown therein. In another embodiment notshown, in operation 1135, the processor 210 may determine a secondcondition different from the first condition of operation 1115. In anembodiment, the second condition may include at least one of theconditions shown in <Table 4>. If the first condition (or secondcondition) is satisfied, the processor 210 may proceed to operation1140. If the first condition (or second condition) is not satisfied, theprocessor 210 may proceed to operation 1145.

In operation 1140, the processor 210 may determine to use a clock levelcorresponding to the second temperature threshold value (hereinafterreferred to as a third clock level), for example, an L5 level (including1.5 GHz for a CPU and 300 MHz for a GPU) as shown in <Table 1>. In anembodiment, the processor 210 may read information on the L5 level fromthe memory 270, provide the information to the clock driving unit 260,and receive a clock signal having a clock speed of the L5 level from theclock driving unit 260.

In operation 1145, the processor 210 may determine to use a clock levelhigher than the third clock level (hereinafter referred to as a fourthclock level), for example, an L3 level (including 2.0 GHz for a CPU and500 MHz for a GPU) as shown in <Table 1>. In an embodiment, theprocessor 210 may read information on the L3 level from the memory 270,provide the information to the clock driving unit 260, and receive aclock signal having a clock speed of the L3 level according to theinformation from the clock driving unit 260. In an embodiment, thefourth clock level may be determined to be higher than the third clocklevel by a given value A. In an embodiment, the fourth clock level mayrefer to a clock speed obtained by increasing the clock speed of thethird clock level by a predetermined value.

After operation 1140 or 1145, the processor 210 may proceed to operation1150.

In operation 1150, for example, the processor 210 may determine whetherthe temperature of the electronic device 101 detected by the temperaturesensor 220 exceeds a third temperature threshold value T3 (for example,80 degrees) given according to the temperature compensation algorithm.If the temperature does not exceed the third temperature thresholdvalue, the processor 210 may return to operation 1105. If the identifiedtemperature exceeds the third temperature threshold value, the processor210 may proceed to operation 1155.

In operation 1155, the processor 210 may determine whether theabove-described first condition is satisfied. In an embodiment, thefirst condition may include S1 shown in <Table 4> or may include atleast one condition and S1 shown therein. In another embodiment notshown, in operation 1155, the processor 210 may determine a thirdcondition different from the first condition of operation 1115 or fromthe second condition of operation 1135. In an embodiment, the thirdcondition may include at least one of the conditions shown in <Table 4>.If the first condition (or third condition) is satisfied, the processor210 may proceed to operation 1160. If the first condition (or thirdcondition) is not satisfied, the processor 210 may proceed to operation1165.

In operation 1160, the processor 210 may determine to use a clock levelcorresponding to the third temperature threshold value (hereinafterreferred to as a fifth clock level), for example, an L7 level (including1 GHz for a CPU and 100 MHz for a GPU) as shown in <Table 1>. In anembodiment, the processor 210 may read information on the L7 level fromthe memory 270, provide the information to the clock driving unit 260,and receive a clock signal having a clock speed of the L7 level from theclock driving unit 260.

In operation 1165, the processor 210 may determine to use a clock levelhigher than the fifth clock level (hereinafter referred to as a sixthclock level), for example, an L5 level (including 1.5 GHz for a CPU and300 MHz for a GPU) as shown in <Table 1>. In an embodiment, theprocessor 210 may read information on the L5 level from the memory 270,provide the information to the clock driving unit 260, and receive aclock signal having a clock speed of the L5 level according to theinformation from the clock driving unit 260. In an embodiment, the sixthclock level may be determined to be higher than the fifth clock level bya given value A. In an embodiment, the sixth clock level may refer to aclock speed obtained by increasing the clock speed of the fifth clocklevel by a predetermined value.

An operation method of an electronic device according to variousembodiments may include operation 910 of determining that a temperaturevalue detected by a temperature sensor included in the electronic deviceexceeds a first temperature threshold value; operation 915 ofdetermining whether a condition is satisfied, the condition beingrelated to at least one of a flexible state of the electronic device,whether a cover case is mounted on the electronic device, or a distancebetween a user's contact position with respect to the electronic deviceand a position at which the at least one processor is positioned in theelectronic device; operation 920 of, based on the condition beingsatisfied, driving the at least one processor according to a first clocklevel corresponding to the temperature value for heating control; andoperation 925 of, based on the condition not being satisfied, drivingthe at least one processor according to a second clock level higher thanthe first clock level.

In an embodiment, the condition may include at least one of a conditionthat the electronic device is a flexible device and the electronicdevice is in a closed state, a condition that the cover case is notmounted on the electronic device, or a condition that the distance iswithin a distance threshold value.

In an embodiment, the condition may include a condition that theelectronic device is a flexible device and is in a closed state, thecover case is not mounted on the electronic device, and the distance iswithin a distance threshold value.

In an embodiment, the first clock level may be one of a plurality ofclock levels configured for a central processing unit (CPU) and/or agraphic processing unit (GPU) included in the electronic device.

In an embodiment, the second clock level may be one of the plurality ofclock levels configured for the central processing unit (CPU) and/or thegraphic processing unit (GPU) included in the electronic device.

In an embodiment, the second clock level may be greater than the firstclock level by a given value.

In an embodiment, the detected temperature value may include at leastone temperature value measured for an application processor (AP) and/ora battery included in the electronic device.

In an embodiment, the method may further comprises determining a secondtemperature threshold value based on the distance between the user'scontact position and the position at which the at least one processor ispositioned in the electronic device, and based on the condition beingsatisfied, and further based on the temperature value detected by thetemperature sensor exceeding the second temperature threshold value,driving the at least one processor according to the first clock levelcorresponding to the temperature value.

In an embodiment, the method may further include an operation ofreceiving information related to the condition from a sensor unitincluded in the electronic device, wherein the sensor unit includes atleast one of: a first sensor configured to detect whether a flexiblestate of the electronic device is a closed state or an open state; asecond sensor configured to detect whether the cover case is in amounted state or an unmounted state with respect to the electronicdevice (e.g., whether the cover case is mounted on the electronic deviceor not); or a third sensor configured to detect the distance between theuser's contact position and the position at which the at least oneprocessor is positioned in the electronic device.

In an embodiment, the electronic device is a foldable device, and theflexible state may be one of a folded state and an unfolded state. In anembodiment, the electronic device is a rollable device, and the flexiblestate may be one of a state in which an open area of a display screen ofthe electronic device is less than a first threshold value and a statein which the open area of the display screen exceeds a second thresholdvalue.

The electronic device according to various embodiments may be one ofvarious types of electronic devices. The electronic devices may include,for example, a portable communication device (e.g., a smartphone), acomputer device, a portable multimedia device, a portable medicaldevice, a camera, a wearable device, or a home appliance. According toan embodiment of the disclosure, the electronic devices are not limitedto those described above.

It should be appreciated that various embodiments of the disclosure andthe terms used therein are not intended to limit the technologicalfeatures set forth herein to particular embodiments and include variouschanges, equivalents, or replacements for a corresponding embodiment.With regard to the description of the drawings, similar referencenumerals may be used to refer to similar or related elements. It is tobe understood that a singular form of a noun corresponding to an itemmay include one or more of the things, unless the relevant contextclearly indicates otherwise. As used herein, each of such phrases as “Aor B,” “at least one of A and B,” “at least one of A or B,” “A, B, orC,” “at least one of A, B, and C,” and “at least one of A, B, or C,” mayinclude any one of, or all possible combinations of the items enumeratedtogether in a corresponding one of the phrases. As used herein, suchterms as “1st” and “2nd,” or “first” and “second” may be used to simplydistinguish a corresponding component from another, and does not limitthe components in other aspect (e.g., importance or order). It is to beunderstood that if an element (e.g., a first element) is referred to,with or without the term “operatively” or “communicatively”, as “coupledwith,” “coupled to,” “connected with,” or “connected to” another element(e.g., a second element), it means that the element may be coupled withthe other element directly (e.g., wiredly), wirelessly, or via a thirdelement.

As used in connection with various embodiments of the disclosure, theterm “module” may include a unit implemented in hardware, software, orfirmware, and may interchangeably be used with other terms, for example,“logic,” “logic block,” “part,” or “circuitry”. A module may be a singleintegral component, or a minimum unit or part thereof, adapted toperform one or more functions. For example, according to an embodiment,the module may be implemented in a form of an application-specificintegrated circuit (ASIC).

Various embodiments as set forth herein may be implemented as software(e.g., the program 140) including one or more instructions that arestored in a storage medium (e.g., internal memory 136 or external memory138) that is readable by a machine (e.g., the electronic device 101).For example, a processor (e.g., the processor 120) of the machine (e.g.,the electronic device 101) may invoke at least one of the one or moreinstructions stored in the storage medium, and execute it. This allowsthe machine to be operated to perform at least one function according tothe at least one instruction invoked. The one or more instructions mayinclude a code generated by a complier or a code executable by aninterpreter. The machine-readable storage medium may be provided in theform of a non-transitory storage medium. Wherein, the term“non-transitory” simply means that the storage medium is a tangibledevice, and does not include a signal (e.g., an electromagnetic wave),but this term does not differentiate between where data issemi-permanently stored in the storage medium and where the data istemporarily stored in the storage medium.

According to an embodiment, a method according to various embodiments ofthe disclosure may be included and provided in a computer programproduct. The computer program product may be traded as a product betweena seller and a buyer. The computer program product may be distributed inthe form of a machine-readable storage medium (e.g., compact disc readonly memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)online via an application store (e.g., PlayStore™), or between two userdevices (e.g., smart phones) directly. If distributed online, at leastpart of the computer program product may be temporarily generated or atleast temporarily stored in the machine-readable storage medium, such asmemory of the manufacturer's server, a server of the application store,or a relay server.

According to various embodiments, each component (e.g., a module or aprogram) of the above-described components may include a single entityor multiple entities, and some of the multiple entities may beseparately disposed in different components. According to variousembodiments, one or more of the above-described components or operationsmay be omitted, or one or more other components or operations may beadded. Alternatively or additionally, a plurality of components (e.g.,modules or programs) may be integrated into a single component. In sucha case, the integrated component may still perform one or more functionsof each of the plurality of components in the same or similar manner asthey are performed by a corresponding one of the plurality of componentsbefore the integration. According to various embodiments, operationsperformed by the module, the program, or another component may becarried out sequentially, in parallel, repeatedly, or heuristically, orone or more of the operations may be executed in a different order oromitted, or one or more other operations may be added.

While the inventive concept has been particularly shown and describedwith reference to example embodiments thereof, it will be understoodthat various changes in form and details may be made therein withoutdeparting from the spirit and scope of the following claims.

1. An electronic device comprising: a temperature sensor; a sensor unit; and at least one processor operatively connected to the temperature sensor and the sensor unit, wherein the at least one processor is configured to: identify that a temperature value detected by the temperature sensor exceeds a first temperature threshold value; determine whether a condition is satisfied, the condition being related to at least one of a flexible state of the electronic device, whether a cover case is mounted on the electronic device, or a distance between a user's contact position with respect to the electronic device and a position at which the at least one processor is positioned in the electronic device; based on the condition being satisfied, operate according to a first clock level corresponding to the temperature value for heating control; and based on the condition not being satisfied, operate according to a second clock level higher than the first clock level.
 2. The electronic device of claim 1, wherein the condition comprises at least one of a condition that the electronic device is a flexible device and the electronic device is in a closed state, a condition that the cover case is not mounted on the electronic device, or a condition that the distance is within a distance threshold value.
 3. The electronic device of claim 1, wherein the condition comprises a condition that the electronic device is a flexible device and is in a closed state, the cover case is not mounted on the electronic device, and the distance is within a distance threshold value.
 4. The electronic device of claim 1, wherein the first clock level is one of a plurality of clock levels configured for a central processing unit (CPU) and/or a graphic processing unit (GPU) included in the electronic device.
 5. The electronic device of claim 1, wherein the second clock level is one of a plurality of clock levels configured for a central processing unit (CPU) and/or a graphic processing unit (GPU) included in the electronic device.
 6. The electronic device of claim 1, wherein the second clock level is greater than the first clock level by a given value.
 7. The electronic device of claim 1, wherein the detected temperature value comprises at least one temperature value measured for an application processor (AP) and/or a battery included in the electronic device.
 8. The electronic device of claim 1, wherein the at least one processor is further configured to: determine a second temperature threshold value based on the distance between the user's contact position and the position at which the at least one processor is positioned in the electronic device; and based on the condition being satisfied, and further based on the temperature value detected by the temperature sensor exceeding the second temperature threshold value, operate according to the first clock level corresponding to the temperature value.
 9. The electronic device of claim 1, wherein the sensor unit comprises at least one of: a first sensor configured to detect whether the flexible state of the electronic device is a closed state or an open state; a second sensor configured to detect whether the cover case is mounted on the electronic device; or a third sensor configured to detect the distance between the user's contact position and the position at which the at least one processor is positioned in the electronic device.
 10. The electronic device of claim 1, wherein the electronic device is a foldable device and the flexible state is one of a folded state and an unfolded state, or wherein the electronic device is a rollable device, and the flexible state is one of a state in which an open area of a display screen of the electronic device is less than a first threshold value and a state in which the open area of the display screen exceeds a second threshold value.
 11. A method of operating an electronic device, the method comprising identifying that a temperature value detected by a temperature sensor included in the electronic device exceeds a first temperature threshold value, determining whether a condition is satisfied, the condition being related to at least one of a flexible state of the electronic device, whether a cover case is mounted on the electronic device, or a distance between a user's contact position with respect to the electronic device and a position at which at least one processor is positioned in the electronic device, based on the condition being satisfied, driving the at least one processor according to a first clock level corresponding to the temperature value for heating control, and based on the condition not being satisfied, driving the at least one processor according to a second clock level higher than the first clock level.
 12. The method of claim 11, wherein the condition comprises at least one of a condition that the electronic device is a flexible device and the electronic device is in a closed state, a condition that the cover case is not mounted on the electronic device, or a condition that the distance is within a distance threshold value.
 13. The method of claim 11, wherein the condition comprises a condition that the electronic device is a flexible device and is in a closed state, the cover case is not mounted on the electronic device, and the distance is within a distance threshold value.
 14. The method of claim 11, further comprising: determining a second temperature threshold value based on the distance between the user's contact position and the position at which the at least one processor is positioned in the electronic device; and based on the condition being satisfied, and further based on the temperature value detected by the temperature sensor exceeding the second temperature threshold value, driving the at least one processor according to the first clock level corresponding to the temperature value.
 15. The method of claim 11, further comprising receiving information related to the condition from a sensor unit included in the electronic device, wherein the sensor unit comprises at least one of: a first sensor configured to detect whether the flexible state of the electronic device is a closed state or an open state; a second sensor configured to detect whether the cover case is mounted on the electronic device; or a third sensor configured to detect the distance between the user's contact position and the position at which the at least one processor is positioned in the electronic device.
 16. The method of claim 11, wherein the first clock level is one of a plurality of clock levels configured for a central processing unit (CPU) and/or a graphic processing unit (GPU) included in the electronic device.
 17. The method of claim 11, wherein the second clock level is one of a plurality of clock levels configured for a central processing unit (CPU) and/or a graphic processing unit (GPU) included in the electronic device.
 18. The method of claim 11, wherein the second clock level is greater than the first clock level by a given value.
 19. The method of claim 11, wherein the detected temperature value comprises at least one temperature value measured for an application processor (AP) and/or a battery included in the electronic device.
 20. The method of claim 11, wherein the electronic device is a foldable device, and the flexible state is one of a folded state and an unfolded state, or the electronic device is a rollable device, and the flexible state is one of a state in which an open area of a display screen of the electronic device is less than a first threshold value and a state in which the open area of the display screen exceeds a second threshold value. 